Basic environmental testing procedures for electronics and telecommunications purposes, Part 2TB: Resistance to soldering heat
Document status: [ Superseded ]
Basic environmental testing procedures for electrotechnology, Part 2TB: Tests - Test Tb - Soldering - Resistance of components to soldering heat
Document status: [ Withdrawn ]
Basic environmental testing procedures for electrotechnology, Part 2TC: Tests - Test Tc - Soldering - Solderability of printed circuit boards and metal-clad base laminates
Document status: [ Withdrawn ]
Basic environmental testing procedures for electronics and telecommunications purposes, Part 2U: Tests - Robustness of terminations
Document status: [ Withdrawn ]
Basic environmental testing procedures for electrotechnology, Part 2UA1: Tests - Test Ua1 - Robustness of terminations - Tensile
Document status: [ Withdrawn ]
Basic environmental testing procedures for electrotechnology, Part 2UA2: Tests - Test Ua2 - Robustness of terminations - Thrust
Document status: [ Withdrawn ]
Basic environmental testing procedures for electrotechnology, Part 2UB: Tests - Test Ub - Robustness of terminations - Bending
Document status: [ Withdrawn ]
Basic environmental testing procedures for electrotechnology, Part 2UC: Tests - Test Uc - Robustness of terminations - Torsion
Document status: [ Withdrawn ]
Basic environmental testing procedures for electrotechnology, Part 2UD: Tests - Test Ud - Robustness of terminations - Torque
Document status: [ Withdrawn ]
Basic environmental testing procedures for electrotechnology, Part 2ZAD: Tests - Test Z/AD - Composite temperature/humidity cyclic test
Document status: [ Superseded ]
