Materials for printed boards and other interconnecting structures Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2,0 W/m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
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Materials for printed boards and other interconnecting structures Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards
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Electroacoustics - Instruments for measurement of aircraft noise - Performance requirements for systems to measure sound pressure levels in noise certification of aircraft
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Fibre optic communication subsystem test procedures Part 1-3: General communication subsystems - Measurement of central wavelength, spectral width and additional spectral characteristics
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Fibre optic communication subsystem test procedures Part 1-4: General communication subsystems - Light source encircled flux measurement method
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Fibre optic communication subsystem test procedures Part 2-8: Digital systems - Determination of low BER using Q-factor measurements
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Fibre-optic communication subsystem test procedures Part 4-1: Installed cable plant - Multimode attenuation measurement
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Fibre-optic communication subsystem test procedures Part 4-1: Installed cable plant - Multimode attenuation measurement
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Fibre-optic communication subsystem test procedures Part 4-1: Installed cable plant - Multimode attenuation measurement
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