Fibre optic active components and devices - Package and interface standards Part 19: Photonic chip scale package
Document status: [ Active ]
Fibre optic active components and devices - Package and interface standards Part 1: General and guidance
Document status: [ Active ]
Fibre optic active components and devices - Package and interface standards Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Document status: [ Revised ]
Fibre optic active components and devices - Package and interface standards Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Document status: [ Active ]
Fibre optic active components and devices - Package and interface standards Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit
Document status: [ Active ]
Fibre optic active components and devices - Performance standards Part 10: Radio-over-fibre (RoF) transceivers for mobile fronthaul
Document status: [ Active ]
Fibre optic active components and devices - Performance standards Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface
Document status: [ Active ]
Fibre optic active components and devices - Performance standards Part 12: Distributed feedback laser diode device for analogue radio over fibre systems
Document status: [ Active ]
Fibre optic active components and devices - Performance standards Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems
Document status: [ Revised ]
Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems
Document status: [ Active ]
