Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
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Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO Level in the electronic assembly technology industries
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Microgrids – Part 4: Use cases IEC
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Printed electronics – Part 302-5: Equipment – Inkjet – Significant characteristics of inkjet printing
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Printed electronics – Part 303-2: Equipment – Sheet to sheet printing – Mechanical dimensions
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Printed electronics – Part 304-1: Equipment – Sintering – Temperature measurement method for photonic sintering system
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Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
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Printed electronics - Part 550-1: Quality assessment - Framework document on durability testing - Mechanical and thermal testing
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Exposure assessment methods for wireless power transfer systems
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Use cases related to ambient assisted living (AAL) in the field of audio, video and multimedia systems and equipment
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