AIA NAS4123 PDF

Name:
AIA NAS4123 PDF

Published Date:
01/31/2024

Status:
[ Active ]

Description:

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

Publisher:
Aerospace Industries Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

File Size :	1 file , 670 KB
Number of Pages :	16
Published :	01/31/2024
Revision :	2

History

AIA NAS4123

Published Date: 01/31/2024

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

$20.7

AIA NAS4123

Published Date: 03/30/2012

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

$19.8

AIA NAS4123

Published Date: 03/30/2012

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

$19.8

AIA NAS4123

Published Date: 01/01/1995

Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)

$19.8

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AIA NAS4123 PDF

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

History

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