AIA NASM45938/3 PDF

AIA NASM45938/3 PDF

Name:
AIA NASM45938/3 PDF

Published Date:
03/29/2013

Status:
[ Active ]

Description:

NUT, PLAIN, CLINCH AND NUT, SELF-LOCKING, CLINCH, SELF CLINCHING, KNURLED COLLAR, 450 Fahrenheit AND 600 Fahrenheit

Publisher:
Aerospace Industries Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$16.5
Need Help?

File Size : 1 file , 74 KB
Number of Pages : 4
Published : 03/29/2013
Revision : 1

History

AIA NASM45938/3
Published Date: 03/29/2013
NUT, PLAIN, CLINCH AND NUT, SELF-LOCKING, CLINCH, SELF CLINCHING, KNURLED COLLAR, 450 Fahrenheit AND 600 Fahrenheit
$16.5
AIA NASM45938/3
Published Date: 09/01/1999
Nut, Plain, Clinch and Nut, Self-Locking, Clinch (Self Clinching, Knurled Collar, 450 Degrees F and 600 Degrees F)
$19.8

Related products

AIA NAS1586
Published Date: 01/01/1981
Bolt, Tension, 12 Pt Ext Wrenching, 1200 Degrees F
$16.5
AIA NAS910
Published Date: 05/31/2012
HORIZONTAL BORING, DRILLING AND MILLING MACHINE
$16.5
AIA NASM24066/4
Published Date: 01/29/2021
CLIP, DOUBLE SLOT, SPRING TENSION
$16.5
AIA NA0055
Published Date: 12/30/2020
RIVET, SOLID, REDUCED COUNTERSUNK 100° HEAD, A286 CRES, METRIC
$16.5

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1