AS K209.2-1971 PDF

AS K209.2-1971 PDF

Name:
AS K209.2-1971 PDF

Published Date:
01/01/1971

Status:
[ Superseded ]

Description:

Methods for the analysis of copper alloys, Part 2: Manganese in copper alloys (atomic absorption spectrometric method)

Publisher:
Standards Australia

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$8.712
Need Help?
Covers the determination of 0.002 to 4 percent manganese.
Edition : 1st
File Size : 1 file , 150 KB
Note : This product is unavailable in Russia, Belarus
Number of Pages : 5
Product Code(s) : 10119200
Published : 01/01/1971

History

AS 1515.2-1994
Published Date: 09/19/1994
Copper alloys, Part 2: Determination of manganese content - Flame atomic absorption spectrometric method
$8.316
AS K209.2-1971
Published Date: 01/01/1971
Methods for the analysis of copper alloys, Part 2: Manganese in copper alloys (atomic absorption spectrometric method)
$8.712

Related products

AS 60068.2.18-2003
Published Date: 01/01/2003
Environmental testing, Part 2.18: Tests - Test R and guidance: Water
$30.492
AS 1189.22-1987
Published Date: 12/31/1986
Data processing - Vocabulary - Calculators
$8.316

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1