Advances in Thermal Modeling of Electronic Components and Systems: Volume 3 PDF

This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.

ISBN(s) :	0791800180
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	450
Published :	01/01/1993