ASTM F459-13(2018) PDF

ASTM F459-13(2018) PDF

Name:
ASTM F459-13(2018) PDF

Published Date:
03/01/2018

Status:
[ Withdrawn ]

Description:

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)

Publisher:
ASTM International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$22.5
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1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).

Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.

1.2 These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see Fig. 1) to be placed under the wire.

FIG. 1 Suggested Configuration for a Pulling Hook

 Suggested Configuration for a Pulling Hook Suggested Configuration for a Pulling Hook

1.3 The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2

1.4 These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.

1.5 A nondestructive procedure is described in Practice F458.

1.6 The values in SI units are to be regarded as standard.

1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.8 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.


File Size : 1 file , 96 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 5
Published : 03/01/2018

History

ASTM F459-13(2018)
Published Date: 03/01/2018
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
$22.5
ASTM F459-13
Published Date: 01/01/2013
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
$17.4
ASTM F459-06
Published Date: 01/01/2006
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
$15
ASTM F459-84(2001)
Published Date: 01/01/2001
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
$15
ASTM F459-84(1995)e1
Published Date: 01/01/1995
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
$15

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