ASTM F542-07 PDF

ASTM F542-07 PDF

Name:
ASTM F542-07 PDF

Published Date:
05/01/2007

Status:
[ Withdrawn ]

Description:

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)

Publisher:
ASTM International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$15
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1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.

Note 1

There is no equivalent IEC standard.


File Size : 1 file , 69 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 3
Published : 05/01/2007
Redline File Size : 2 files , 130 KB

History

ASTM F542-07
Published Date: 05/01/2007
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
$15
ASTM F542-02
Published Date: 09/10/2002
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
$15
ASTM F542-98
Published Date: 10/10/1998
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
$16.2

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