ASTM F638-88(1995)e1 PDF

ASTM F638-88(1995)e1 PDF

Name:
ASTM F638-88(1995)e1 PDF

Published Date:
01/01/2001

Status:
Active

Description:

Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding

Publisher:
ASTM International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$16.2
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1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.


File Size : 1 file , 30 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 3
Published : 01/01/2001

History

ASTM F638-88(2001)
Published Date: 01/01/2001
Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)
$15
ASTM F638-88(1995)e1
Published Date: 01/01/2001
Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
$16.2

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