AWWA ACE61699 PDF

AWWA ACE61699 PDF

Name:
AWWA ACE61699 PDF

Published Date:
06/17/2005

Status:
Active

Description:

Predicting the Efficiency of Filter Backwash

Publisher:
American Water Works Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$7.2
Need Help?
This paper describes an experimental investigation into the effect of backwash rate, type of coagulant, degree of clogging and accumulation of residual deposits (not removed by backwash) on the efficiency of fluidized bed filter backwash in laboratory scale filters treating a natural raw water coagulated with either alum or a cationic polymer blend. Backwash efficiency was defined in terms of the mass of floc retained in the filter after backwashing. Small variations in the raw water characteristics (manifested as variations in raw water turbidity, temperature, pH, rate of headloss development and turbidity removal efficiency) within each set of experiments appeared to affect the efficiency of backwash in addition to the parameters varied deliberately. Stepwise linear regression was used to determine which of several possible filtration and backwash parameters were the best predictors of backwash performance. Backwash rate, filter run time, rate of headloss development and mass of residual deposits accumulated during previous runs were found to be the best predictors of backwash efficiency for any given filter cycle. Floc deposits appeared to become more difficult to remove the longer they remained in the filter, while rate of headloss development appeared to provide some indication of floc adhesiveness for filter runs of similar length. The efficiency of detachment of freshly deposited floc appeared to increase as the mass of residual deposits and mudballs in the filter increased. The simple linear correlations developed here provide an important first step towards developing and calibrating a more comprehensive model of backwash efficiency that could be easily integrated with existing models of filtration. While this investigation was limited to fluidized bed backwash without air scour or surface wash, the general approach is equally applicable to the more technologically relevant case of backwash with auxiliary wash. Includes 18 references, tables, figures.
Edition : Vol. - No.
File Size : 1 file , 1.9 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 20
Published : 06/17/2005

History


Related products

AWWA ACE61632
Published Date: 06/17/2005
Protecting Public Health from the Impact of Body Contact Recreation
$7.2
AWWA ACE61653
Published Date: 06/17/2005
Water Quality Modeling to Support Switching to Chloramines: A Case Study
$7.2
AWWA ACE61670
Published Date: 06/17/2005
Performance of pH Independent Free Chlorine Sensor
$7.2
AWWA ACE61748
Published Date: 06/17/2005
The Private Sector in Water Supply and Sanitation: Where Did It Go and Why? Can We Bring It Back?
$7.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1