AWWA JAW24300 PDF

Name:
AWWA JAW24300 PDF

Published Date:
11/01/1988

Status:
Active

Description:

Journal AWWA - Predicting Pipeline Frost Load

Publisher:
American Water Works Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

A study was undertaken to find a formula for predicting the additional load imposed on underground pipelines by soil freezing. The authors conclude that a modified Boussinesq equation can be used to assess this load. Results also showed that frost affects the modulus of soil reaction and therefore the induced stress in flexible pipe. Includes 9 references, tables, figures.

Edition :	Vol. 80 - No. 11
File Size :	1 file , 1.6 MB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	8
Published :	11/01/1988

History

Related products

AWWA QTC97204

Published Date: 01/01/1997

Nitrification in Chloraminated Drinking Water and Its Association With Biofilms

$7.2

AWWA JAW24296

Published Date: 11/01/1988

Journal AWWA - Predicting Internal Roughness in Water Mains

AWWA JAW24297

Published Date: 11/01/1988

Journal AWWA - An Improved Method for Corrosion-Rate Measurement by Weight Loss

AWWA JAW24298

Published Date: 11/01/1988

Journal AWWA - Trace Metal Contamination From Brass Fittings

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

$12.6

IEC/PAS 60050-732 Ed. 1.0 b:2007

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

$61.2

IEC/PAS 60092-510 Ed. 1.0 en:2009

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

$89.7

IEC/PAS 60099-7 Ed. 1.0 en:2004

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

$95.1

IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

$29.1

IEC/PAS 60191-6-19 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

$32.1