BS ISO/TR 11762:1992 PDF

BS ISO/TR 11762:1992 PDF

Name:
BS ISO/TR 11762:1992 PDF

Published Date:
01/15/1996

Status:
Active

Description:

Light-gauge metal containers. Round open-top cans for liquid products with added gas. Classification of can sizes by construction type

Publisher:
British Standard / International Organization for Standardization - Technical Report

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$48.006
Need Help?


Cross References:
ISO 90-1
ISO 10654


Replaces Parts 1, 2, 3, 4 and 5 of BS 6992.
File Size : 1 file , 320 KB
ISBN(s) : 0580251926
Number of Pages : 12
Product Code(s) : 656173, 656173, 00656173
Published : 01/15/1996
Same As : BS ISO/TR 11762:1992

History

BS ISO/TR 11762:1992
Published Date: 01/15/1996
Light-gauge metal containers. Round open-top cans for liquid products with added gas. Classification of can sizes by construction type
$48.006

Related products


Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1