BS 10/30214593 DC PDF

BS 10/30214593 DC PDF

Name:
BS 10/30214593 DC PDF

Published Date:
01/15/2010

Status:
Active

Description:

BS ISO 16175-3. Information and documentation. Principles and functional requirements for records in electronic office environments. Part 3. Guidelines and functional requirements for records in business systems

Publisher:
BSI Group

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
Need Help?


All current amendments available at time of purchase are included with the purchase of this document.
Number of Pages : 80
Published : 01/15/2010

History


Related products

BS 5699-2:1979
Published Date: 02/28/1979
Processed photographic film for archival records-Specifications for silver-gelatin type on poly(ethylene terephthalate) base
$57.15
BS ISO 4087:2005
Published Date: 08/09/2005
Micrographics. Microfilming of newspapers for archival purposes on 35 mm microfilm
$57.15

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1