BS EN 60317-21. Specifications for particular types of winding wires. Part 21. Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 155
BS EN 60317-21. Specifications for particular types of winding wires. Part 21. Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 155
Specifications for particular types of winding wires-Glass-fibre wound silicone resin or varnish impregnated, bare or enamelled round copper wire, temperature index 200
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage