BS 132:1965 PDF

BS 132:1965 PDF

Name:
BS 132:1965 PDF

Published Date:
08/12/1965

Status:
Active

Description:

Specification for steam turbines

Publisher:
BSI Group

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$79.248
Need Help?


All current amendments available at time of purchase are included with the purchase of this document.
ISBN(s) : null
Note : This product is unavailable in Ukraine, Russia, Belarus
Product Code(s) : 30305089
Published : 08/12/1965

History


Related products

BS EN 12952-2:2021
Published Date: 01/21/2022
Water-tube boilers and auxiliary installations-Materials for pressure parts of boilers and accessories
$105.156
BS EN 45510-6-5:2000
Published Date: 01/15/2000
Guide for the procurement of power station equipment. Turbine auxiliaries-Dry cooling systems-Section 5: Dry cooling systems
$79.248

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1