BS EN 60749-9:2017 is to determine whether the marks on solid state
semiconductor devices will remain legible when subjected to the application and removal of
labels or the use of solvents and cleaning solutions commonly used during the removal of
solder flux residue from the printed circuit board manufacturing process.
This test is applicable for all package types. It is suitable for use in qualification and/or
process monitor testing. The test is considered non-destructive. Electrical or mechanical
rejects can be used for the purpose of this test.
Cross References:IEC 61340-2-3:2016
EN 61340-2-3 (IEC 61340-2-3:2016) AS
FED-STD-101C
All current amendments available at time of purchase are included with the purchase of this document. | File Size : | 1
file
, 830 KB |
| ISBN(s) : | 9780580949357 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 12 |
| Product Code(s) : | 30345064, 30345064, 30345064 |
| Published : | 11/27/2017 |
