BS EN IEC 60191-1:2018 gives guidelines on the preparation of outline drawings of discrete
devices, including discrete surface-mounted semiconductor devices with lead count less than
8.
For the preparation of outline drawings of surface-mounted discrete devices with a lead count
higher or equal to 8, IEC 60191-6 should be referred to as well.
The primary object of these drawings is to indicate the space to be allowed for devices in
equipment, together with other dimensional characteristics required to ensure mechanical
interchangeability.
Complete interchangeability involves other considerations such as the electrical and thermal
characteristics of the semiconductor devices concerned.
The international standardization represented by these drawings therefore encourages the
manufacturers of devices to comply with the tolerances shown on the drawings in order to
extend their range of customers internationally. It also gives equipment designers an
assurance of mechanical interchangeability between the devices obtained from suppliers in
different countries, provided they allow the space in their equipment that is indicated by the
drawings and take note of the more precise information on bases, studs, etc.
Cross References:IEC 60191-6-3
IEC 60191-4
IEC 60191-6-20
IEC 60191-6-21
IEC 60191-2
IEC 60191-6-1
ISO 263
IEC 60191-6 (all parts)
ISO 3705
ISO 261
ISO 5459:2011
All current amendments available at time of purchase are included with the purchase of this document. | File Size : | 1
file
, 1.7 MB |
| ISBN(s) : | 9780580844256 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 44 |
| Product Code(s) : | 30290463, 30290463, 30290463 |
| Published : | 04/30/2018 |
