This part of IEC 60539 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.
Cross References:IEC 60068-2-78
EN 60068-2-2:2007
IEC 60068-2-58:2015/AMD1:2017
IEC 61193-2:2007
EN 60539-1:2016
IEC 60068-2-2:2007
EN 60068-2-58:2015
IEC 60068-2-14:2009
EN 61193-2:2007
EN 60068-2-14:2009
EN 60068-2-58:2015/A1:2018
IEC 60068-2-58:2015
IEC 60539-1:2016
All current amendments available at time of purchase are included with the purchase of this document. | File Size : | 1
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| ISBN(s) : | 9780580991042 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 28 |
| Product Code(s) : | 30362995, 30362995, 30362995 |
| Published : | 09/30/2019 |
