BS EN IEC 61190-1-3:2018 PDF

BS EN IEC 61190-1-3:2018 PDF

Name:
BS EN IEC 61190-1-3:2018 PDF

Published Date:
03/28/2018

Status:
Active

Description:

Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Publisher:
British-Adopted European Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$105.156
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BS EN IEC 61190-1-3:2018 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.


Cross References:
IEC 61189-5-3:2015
IEC 61189-5-2:2015
IEC 61190-1-1:2002
EN 61190-1-1 (IEC 61190-1-1:2002 AS)
IEC 60194:2015
EN 61189-5-4 (IEC 61189-5-4:2015) AS
IEC 61189-5-4:2015
EN 61189-5-2 (IEC 61189-5-2:2015) AS
IEC 61190-1-2
EN 61190-1-2
EN 61189-5-3 (IEC 61189-5-3:2015) AS
IEC 61189-5
EN ISO 9453
ISO 9454-2
IEC 61189-6
EN 61189-5
EN 61189-6
ISO 9453
EN ISO 9454-1
ISO 9454-1
EN ISO 9454-2
ISO 1073-1


All current amendments available at time of purchase are included with the purchase of this document.
File Size : 1 file , 1.4 MB
ISBN(s) : 9780580892387
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 48
Product Code(s) : 30318682, 30318682, 30318682
Published : 03/28/2018

History

BS EN IEC 61190-1-3:2018
Published Date: 03/28/2018
Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
$105.156
BS EN 61190-1-3:2002
Published Date: 08/12/2002
Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$92.964

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BS EN IEC 61190-1-3:2018
Published Date: 03/28/2018
Attachment materials for electronic assembly-Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
$105.156

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