BS IEC 61366-4:1998 PDF

BS IEC 61366-4:1998 PDF

Name:
BS IEC 61366-4:1998 PDF

Published Date:
09/15/1998

Status:
Active

Description:

Hydraulic turbines, storage pumps, and pump turbines. Tendering documents-Guidelines for technical specifications for Kaplan and propeller turbines

Publisher:
British Standard / International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$79.248
Need Help?


Cross References:
IEC 60041:1992
IEC 60193:1965
IEC 60308:1970
IEC 60545:1976
IEC 60609:1978
IEC 60994:1991
IEC 61362
ISO 3740:1980

File Size : 1 file , 560 KB
ISBN(s) : 0580303187
Number of Pages : 28
Product Code(s) : 1469816, 1469816, 01469816
Published : 09/15/1998

History


Related products

BS EN IEC 62097:2019
Published Date: 05/09/2019
Hydraulic machines, radial and axial. Methodology for performance transposition from model to prototype
$119.634

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1