Semiconductor devices. Micro-electromechanical devices-Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Publisher:
British Standard / International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

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This part of IEC 62047 specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 1 MB
ISBN(s) :	9780580899096
Number of Pages :	20
Product Code(s) :	30321849, 30321849, 30321849
Published :	07/22/2020

BS IEC 62047-27:2017 PDF

Semiconductor devices. Micro-electromechanical devices-Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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