BS IEC 63011-1:2018 PDF

BS IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.


Cross References:
IEC 60050-411:1996
IEC 60050-161:1990
IEC 60050-131:2002
IEC 60050-713
IEC 63011-2
IEC 63011-3
IEC 60050-714


All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 990 KB
ISBN(s) :	9780580962783
Number of Pages :	14
Product Code(s) :	30350967, 30350967, 30350967
Published :	01/24/2019