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BS IEC 63011-3:2018 PDF

BS IEC 63011-3:2018 PDF

Name:
BS IEC 63011-3:2018 PDF

Published Date:
01/24/2019

Status:
Active

Description:

Integrated circuits. Three dimensional integrated circuits-Model and measurement conditions of through-silicon via

Publisher:
British Standard / International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$57.15
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BS IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.


Cross References:
IEC 63011-1


All current amendments available at time of purchase are included with the purchase of this document.
File Size : 1 file , 1.6 MB
ISBN(s) : 9780580962790
Number of Pages : 16
Product Code(s) : 30350971, 30350971, 30350971
Published : 01/24/2019

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