Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Publisher:
BSI Group

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

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This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

Cross References:
IEC 60068-2-20:2008
IEC 61189-5-501

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 5.1 MB
ISBN(s) :	9780539000689
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	26
Product Code(s) :	30373834, 30373834, 30373834
Published :	07/18/2019

BS PD IEC TR 61189-5-506:2019 PDF

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