BS EN 60191-6-20. Mechanical standardization of semiconductor devices. Part 6-20. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine pitch land grid array (FLGA)-Proposed amendment on terminology
IEEE/CSA Standard for Skin Effect Trace Heating of Pipelines, Vessels, Equipment, and Structures - General, Testing, Marking, and Documentation Requirements
IEEE/CSA Standard for Impedance Heating of Pipelines and Equipment - Application Guide for Design, Installation, Testing, Commissioning, and Maintenance
