BS 12/30274804 DC PDF

Published Date: 11/12/2012

BS IEC 61189-5-4. Test methods for electrical materials, interconnection structures and assemblies. Part 5-4. Test methods for printed board assemblies. Solder alloys and fluxed and non-fluxed solid wire

Published Date: 03/31/1992

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards

Published Date: 06/15/1999

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film

Published Date: 2020

Enclosures for Electrical Equipment (1,000 Volts Maximum)

Published Date: 2022

Determination of Certain Substances in Electrotechnical Products Part 1: Introduction and Overview Published

Published Date: 2020

Determination of Certain Substances in Electrotechnical Products Part 10: Polycyclic Aromatic Hydrocarbons (PAHs) in Polymers and Electronics by Gas Chromatography-Mass Spectrometry (GC-MS)

Published Date: 2022

Determination of Certain Substances in Electrotechnical Products Part 2: Disassembly, Disjointment and Mechanical Sample Preparation

Published Date: 2023

Determination of Certain Substances in Electrotechnical Products Part 3-1: Screening--Lead, Mercury, Cadmium, Total Chromium and Total Bromine Using X-Ray Fluorescence Spectrometry

Published Date: 2023

Determination of Certain Substances in Electrotechnical Products Part 3-2: Screening--Fluorine, Bromine and Chlorine in Polymer and Electronics by Combustion-Ion Chromatography (C-IC)