BS IEC 61189-5-4. Test methods for electrical materials, interconnection structures and assemblies. Part 5-4. Test methods for printed board assemblies. Solder alloys and fluxed and non-fluxed solid wire
BS IEC 61189-5-4. Test methods for electrical materials, interconnection structures and assemblies. Part 5-4. Test methods for printed board assemblies. Solder alloys and fluxed and non-fluxed solid wire
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
