BS 2511:1970 PDF

BS 2511:1970 PDF

Name:
BS 2511:1970 PDF

Published Date:
04/30/1970

Status:
Active

Description:

Methods for the determination of water (Karl Fischer method)

Publisher:
BSI Group

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$92.964
Need Help?
Preparation and standardization of Fischer reagent; its application to determination of water in various substances including ketones; double and single burette method with electrometric endpoints; single burette method with visual end point; determination of microgramme quantities of water. Notes on sampling for determination of low water contents.

Cross References:
BS 506
BS 846
BS 1428:Part D1
BS 1583
BS 1792

File Size : 1 file , 3.5 MB
ISBN(s) : 0580056384
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 36
Product Code(s) : 108926, 108926, 00108926
Published : 04/30/1970

History


Related products


Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1