Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

Publisher:
British-Adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Cross References:
IEC 60191-6
EN 60191-6
IEC 60191-6-2
IEC 60191-6-4
IEC 60191-6-5
EN 60191-6-2
EN 60191-6-4
EN 60191-6-5

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 1.7 MB
ISBN(s) :	9780580719479, 9780580615320
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	24
Product Code(s) :	30229893, 30229893, 30229893
Published :	10/31/2010

BS EN 60191-6-18:2010 PDF

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

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