BS EN 60191-6-19:2010 PDF

BS EN 60191-6-19:2010 PDF

Name:
BS EN 60191-6-19:2010 PDF

Published Date:
06/30/2010

Status:
Active

Description:

Mechanical standardization of semiconductor devices-Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Publisher:
British-Adopted European Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
bs-en-60191-6-19-2010_1722627

Choose Document Language:
57.15
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Cross References:
IEC 60191-6-2
IEC 60191-6-5
IEC 60749-20
EN 60191-6-2
EN 60191-6-5
EN 60749-20


All current amendments available at time of purchase are included with the purchase of this document.
File Size : 1 file , 1.5 MB
ISBN(s) : 9780580607585
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Product Code(s) : 30172910, 30172910, 30172910
Published : 06/30/2010

History


Related products

BS EN 60191-6-4:2003
Published Date: 08/04/2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
57.15 €

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