Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Publisher:
British-Adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Cross References:
IEC 60191-4
IEC 60191-6
EN 60191-4
EN 60191-6

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 1.2 MB
ISBN(s) :	9780580645662
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	16
Product Code(s) :	30190027, 30190027, 30190027
Published :	12/31/2010

BS EN 60191-6-20:2010 PDF

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)

History

Related products

Best-Selling Products