BS EN IEC 61188-6-1:2021 PDF

BS EN IEC 61188-6-1:2021 PDF

Name:
BS EN IEC 61188-6-1:2021 PDF

Published Date:
04/07/2021

Status:
Active

Description:

Circuit boards and circuit board assemblies. Design and use-Land pattern design. Generic requirements for land pattern on circuit boards

Publisher:
British-Adopted European Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$92.964
Need Help?
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

All current amendments available at time of purchase are included with the purchase of this document.
File Size : 1 file , 5.1 MB
ISBN(s) : 9780580997181
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 36
Product Code(s) : 30372191, 30372191, 30372191
Published : 04/07/2021

History

BS EN IEC 61188-6-1:2021
Published Date: 04/07/2021
Circuit boards and circuit board assemblies. Design and use-Land pattern design. Generic requirements for land pattern on circuit boards
$92.964

Related products

BS 6221-8:1982
Published Date: 10/29/1982
Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards with through connections
$57.15
BS CECC 23100-003:1996
Published Date: 04/15/1996
Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes
$79.248

Best-Selling Products

Handbook of Applied Photometry
Published Date: 12/01/1997
$29.7