This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series.
This document is applicable to the SMD of semiconductor devices and electrical components.
Cross References:IEC 60194-2
IEC 60194
EN 61188-5-4
IEC 61188-5-3
IEC 60191-1
EN 61188-5-1
IEC 61188-5-8
IEC 60191-6-1
IEC 61188-5-6
IEC 61188-5-2
EN 61191-2
IEC 61188-5-5
IPC-A-610F
IEC 61191-2
IPC-2221B
EN 60191-6-1
IEC 60191-6
EN 60191-6
EN 61188-5-2
IEC 61188-5-4
IEC 61188-5-1
EN 61188-5-8
EN 61188-5-3
EN IEC 61191-1
EN 61188-5-5
EN IEC 60191-1
IEC 61191-1
EN 61188-5-6
All current amendments available at time of purchase are included with the purchase of this document. | File Size : | 1
file
, 3.1 MB |
| ISBN(s) : | 9780580966422 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 46 |
| Product Code(s) : | 30352545, 30352545, 30352545 |
| Published : | 07/12/2019 |
