BS EN IEC 61189-5-601:2021 PDF

BS EN IEC 61189-5-601:2021 PDF

Name:
BS EN IEC 61189-5-601:2021 PDF

Published Date:
03/19/2021

Status:
Active

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Publisher:
British-Adopted European Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:
bs-en-iec-61189-5-601-2021_2213193

Choose Document Language:
$105.16
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This part of IEC 61189 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.

All current amendments available at time of purchase are included with the purchase of this document.
File Size : 1 file , 2 MB
ISBN(s) : 9780580965845
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 46
Product Code(s) : 30352487, 30352487, 30352487
Published : 03/19/2021

History


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