Surface mounting technology-Standard method for the specification of components for through-hole reflow (THR) soldering

Publisher:
British-Adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

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This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 2.5 MB
ISBN(s) :	9780539045857
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	34
Product Code(s) :	30394490, 30394490, 30394490
Published :	03/18/2021

BS EN IEC 61760-3:2021 PDF

Surface mounting technology-Standard method for the specification of components for through-hole reflow (THR) soldering

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