This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
All current amendments available at time of purchase are included with the purchase of this document. | File Size : | 1
file
, 1.2 MB |
| ISBN(s) : | 9780539135763 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 20 |
| Product Code(s) : | 30417697, 30417697, 30417697 |
| Published : | 06/15/2021 |
