BS PD IEC TR 60286-7:2019 PDF

This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Cross References:
IEC 60286-3:2019
IEC 61340-5-3:2015
IEC 62090:2017
IEC 61340-5-1:2016


All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 1.9 MB
ISBN(s) :	9780539032666
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	16
Product Code(s) :	30388258, 30388258, 30388258
Published :	10/29/2019