Materials for printed boards and other interconnecting structures-Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Document status: Active
Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
Document status: Active
Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Document status: Active
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
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Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Transfer adhesive films for flexible printed boards
Document status: Active
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
Document status: Active
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
Document status: Active
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Document status: Active
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Document status: Active
Materials for printed boards and other interconnecting structures-Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Document status: Active
