Materials for printed boards and other interconnecting structures Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Document status: [ Active ]
Materials for printed boards and other interconnecting structures Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven Eglass prepreg of defined flammability (vertical burning test) for lead-free assembly
Document status: [ Active ]
Materials for printed boards and other interconnecting structures Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Document status: [ Active ]
Materials for printed boards and other interconnecting structures Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Document status: [ Active ]
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
Document status: [ Active ]
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
Document status: [ Active ]
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
Document status: [ Active ]
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
Document status: [ Active ]
Materials for interconnection structurs - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
Document status: [ Active ]
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
Document status: [ Active ]
