Semiconductor die products - Part 4: Questionnaire for die users and suppliers
Document status: [ Active ]
Semiconductor die products - Part 7: XML schema for data exchange
Document status: [ Active ]
Semiconductor die products - Part 8: EXPRESS model schema for data exchange
Document status: [ Active ]
High-voltage switchgear and controlgear - Part 208: Methods to quantify the steady state, power-frequency electromagnetic fields generated by HV switchgear assemblies and HV/LV prefabricated substations
Document status: [ Active ]
Field device tool (FDT) interface specification – Part 41: Object model integration profile – Common object model
Document status: [ Withdrawn ]
Field device tool (FDT) interface specification – Part 501: Communication implementation for common object model – IEC 61784 CPF 1
Document status: [ Withdrawn ]
Field device tool (FDT) interface specification – Part 502: Communication implementation for common object model – IEC 61784 CPF 2
Document status: [ Withdrawn ]
Field device tool (FDT) interface specification – Part 503-1: Communication implementation for common object model – IEC 61784 CP 3/1 and CP 3/2
Document status: [ Withdrawn ]
Field device tool (FDT) interface specification – Part 503-2: Communication implementation for common object model – IEC 61784 CP 3/4, CP 3/5 and CP 3/6
Document status: [ Withdrawn ]
Field device tool (FDT) interface specification – Part 506: Communication implementation for common object model – IEC 61784 CPF 6
Document status: [ Withdrawn ]
