Specification for Base Materials for High Speed/High Frequency Applications
Document status: Active
Specifications for High Density Interconnect (HDI) and Microvia Materials
Document status: Active
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
Document status: Active
Specification and Characterization Methods for Nonwoven "E" Glass Materials
Document status: Active
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
Document status: Active
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
Document status: Active
Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards
Document status: Active
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
Document status: Active
Cover and Bonding Material for Flexible Printed Circuitry
Document status: Active
Cover and Bonding Material for Flexible Printed Circuitry
Document status: [ Withdrawn ]
