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Adhesive Film, Epoxy-Base for High Durability Structural Adhesive Bonding
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Aerodynamic Fairing Compound, -55 to +85\mDC (-65 to +185\mDF) ( Noncurrent: Jul 1991 Feb 2004 )
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Aerodynamic Fairing Compound −55° to +85°C (−65° to +185°F) (Stabilized: Jan 2012)
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Aerodynamic Fairing Compound, -55 to +150\mDC (-65 to +300\mDF) ( Noncurrent: Jul 1991 Feb 2004 )
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Aerodynamic Fairing Compound −55° to +150°C (−65° to +300°F) (Stabilized: Jan 2012)
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ADHESIVE FILM, HOT-MELT, ADDITION-TYPE POLYIMIDE For Foam Sandwich Structure, â55 to +230 °C (â65 to +450 °F) (Noncurrent: Jan 1993)
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Resin System, Epoxy, Carbon Microballoon Filled, 135 °C (275 °F) Cure
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EPOXY RESIN, TETRAGLYCIDYL METHYLENEDIANILINE (TGMDA) 10,000 – 14,000 Centipoise Viscosity
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Epoxy Resin, Tetraglycidyl Methylenedianiline (TGMDA), 10,000 to 14,000 Centipoise Viscosity
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