CEI 81-30 PDF

CEI 81-30 PDF

Name:
CEI 81-30 PDF

Published Date:
02/01/2014

Status:
[ Withdrawn ]

Description:

Protezione contro i fulmini - Reti di localizzazione fulmini (LLS) - Linee guida per l'impiego di sistemi LLS per l'individuazione dei valori di Ng (Norma CEI EN 62305-2)

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$7.5
Need Help?

Edition : 14
File Size : 2 files , 370 KB
Number of Pages : 18
Published : 02/01/2014

History


Related products

CEI EN 62071-2
Published Date: 10/01/2006
Helical-scan compressed digital video cassette system using 6,35 mm magnetic tape - Format D-7 Part 2: Compression format
$57.6
CEI EN IEC 61730-1
Published Date: 06/01/2018
Photovoltaic (PV) module safety qualification Part 1: Requirements for construction
$35.1
CEI EN IEC 62841-3-9
Published Date: 03/01/2021
Electric motor-operated hand-held tools, transportable tools and lawn and garden machinery - Safety Part 3: Particular requirements for transportable mitre saws
$31.5
CEI EN IEC 60317-62
Published Date: 03/01/2021
Specifications for particular types of winding wires Part 62: Polyester glass-fibre wound, silicone resin or varnish impregnated, bare or enamelled rectangular copper wire, temperature index 200
$11.7

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1