CEI 99-5 PDF

Name:
CEI 99-5 PDF

Published Date:
07/01/2015

Status:
[ Active ]

Description:

Guida per l’esecuzione degli impianti di terra delle utenze attive e passive connesse ai sistemi di distribuzione con tensione superiore a 1 kV in c.a.

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Edition :	15
File Size :	1 file , 3.7 MB
Number of Pages :	158
Published :	07/01/2015

History

Related products

CEI EN 60947-4-1

Published Date: 05/01/2012

Low-voltage switchgear and controlgear Part 4-1: Contactors and motor-starters - Electromechanical contactors and motor-starters

$108.3

CEI EN IEC 60598-2-22

Published Date: 01/01/2023

Luminaires Part 2-22: Particular requirements - Luminaires for emergency lighting

$29.1

CEI EN IEC 62769-7

Published Date: 11/01/2021

Field Device Integration (FDI) Part 7: Communication Devices

$41.1

CEI EN 60317-40

Published Date: 11/01/2000

Specifications for particular types of winding wires - Part 40: Glass-fibre braided, silicone varnish-treated, bare or enamelled rectangular copper wire, temperature index 200

$10.8

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

$12.6

IEC/PAS 60050-732 Ed. 1.0 b:2007

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

$61.2

IEC/PAS 60092-510 Ed. 1.0 en:2009

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

$89.7

IEC/PAS 60099-7 Ed. 1.0 en:2004

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

$95.1

IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

$29.1

IEC/PAS 60191-6-19 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

$32.1