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CEI EN 60068-2-58/A1 PDF

CEI EN 60068-2-58/A1 PDF

Name:
CEI EN 60068-2-58/A1 PDF

Published Date:
08/01/2018

Status:
[ Active ]

Description:

Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$8.1
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BILINGUAL

Replace the existing second paragraph of the Scope with the following new paragraph:

This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.


Edition : 16
File Size : 1 file , 2 MB
Number of Pages : 14
Published : 08/01/2018

History

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