CEI EN 60191-6-10 PDF

Name:
CEI EN 60191-6-10 PDF

Published Date:
11/01/2005

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Norma recepita mediante l'annuncio su CEINFORMA novembre 2005.

Edition :	05
File Size :	1 file , 210 KB
Number of Pages :	20
Published :	11/01/2005

History

Related products

CEI EN 60998-2-4

Published Date: 05/01/2006

Connecting devices for low voltage circuits for household and similar purposes - Part 2-4: Particular requirements for twist-on connecting devices

$25.5

CEI EN IEC 60034-2-3

Published Date: 06/01/2024

Rotating electrical machines – Part 2-3: Specific test methods for determining losses and efficiency of converter-fed AC motors

$24.6

CEI EN 60297-3-105

Published Date: 05/01/2010

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-105: Dimensions and design aspects for 1U chassis

$16.8

Best-Selling Products

IFAI CPAI-75

Published Date:

Rate of Burn Specifications for Sleeping Bags

$60

IFAI CPAI-84

Published Date: 01/01/2021

Specification for Flame-resistant Materials Used in Camping Tentage

IFAI MARINE FABRICATOR DESIGN

Published Date:

Marine Fabricator Design & Fabrication Manual

$17.4

IFAI STATE OF THE INDUSTRY

Published Date: 01/01/2021

State of the Industry

$187.8

IFAI USIFI-DTL 55308A

Published Date: 03/16/2010

Detail Specification — Cloth and Strip, Laminated or Coated, Vinyl, Reinforced, High Strength, Flexible

$37.2