CEI EN 60191-6-13 PDF

Name:
CEI EN 60191-6-13 PDF

Published Date:
05/01/2017

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.

Edition :	17
File Size :	1 file , 2.7 MB
Number of Pages :	28
Published :	05/01/2017

History

CEI EN 60191-6-13

Published Date: 05/01/2017

Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

$15

CEI EN 60191-6-13

Published Date: 03/01/2009

Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

$13.8

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