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CEI EN 60191-6-13 PDF

CEI EN 60191-6-13 PDF

Name:
CEI EN 60191-6-13 PDF

Published Date:
05/01/2017

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Publisher:
Comitato Elettrotecnico Italiano

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
cei-en-60191-6-13_2733256
Choose Document Language:
15.00 €
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This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.


Edition : 17
File Size : 1 file , 2.7 MB
Number of Pages : 28
Published : 05/01/2017

History

CEI EN 60191-6-13
CEI EN 60191-6-13
Published Date: 05/01/2017
Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
15.00 €
CEI EN 60191-6-13
CEI EN 60191-6-13
Published Date: 03/01/2009
Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
13.80 €

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