CEI EN 60191-6-18 PDF

Name:
CEI EN 60191-6-18 PDF

Published Date:
02/01/2011

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

La presente Norma recepisce il testo originale inglese della Pubblicazione IEC. La presente Norma viene pubblicata dal CEI nella sola lingua inglese in quanto trova diffusione in un ambito tecnico-scientifico di elevata specializzazione.

Edition :	11
File Size :	1 file , 880 KB
Number of Pages :	30
Published :	02/01/2011

History

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