CEI EN 60191-6-22 PDF

Name:
CEI EN 60191-6-22 PDF

Published Date:
02/01/2014

Status:
[ Active ]

Description:

Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Publisher:
Comitato Elettrotecnico Italiano

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Edition :	14
File Size :	1 file , 390 KB
Number of Pages :	22
Published :	02/01/2014

History

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